Optical non-contact micrometer thickness measurement system for silica thick films

K. Thambiratnam, H. Ahmad, M. Yasin, A. Z. Zulkifli, S. W. Harun

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

In this paper, a novel optical approach is proposed and demonstrated for the non-contact measurement for the thickness of silica thick films. This approach is based on the principal of an optical based displacement sensor. The calibration curve for the measurement of the thickness of an unknown sample is obtained using four sample with known thicknesses of 6.90, 10.23, 19.69 and 25.47 μm respectively. As compared to a prism coupler, which is assumed to provide the most precise measurement of thick film thicknesses, the proposed system has an error of approximately 8%. The proposed method is able to provide a simple, low cost and time saving approach in measuring thick films thicknesses during fabrication.

Original languageEnglish
Title of host publicationReflection, Scattering, and Diffraction from Surfaces III
DOIs
Publication statusPublished - 2012
EventReflection, Scattering, and Diffraction from Surfaces III - San Diego, CA, United States
Duration: 13 Aug 201216 Aug 2012

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8495
ISSN (Print)0277-786X

Conference

ConferenceReflection, Scattering, and Diffraction from Surfaces III
Country/TerritoryUnited States
CitySan Diego, CA
Period13/08/1216/08/12

Keywords

  • Bundled probe
  • Displacement sensor
  • Fiber optic
  • Intensity based modulation
  • Micro-thickness
  • Planar waveguide circuit
  • Thick-films
  • Translation stage

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