Keyphrases
Microtexture
78%
Oxygen Plasma Etching
75%
Diamond Coating
72%
High Density
51%
Electron Density
51%
Hollow Cathode
51%
Ashing
48%
Diamond-like
48%
Plasma Diagnostics
43%
Ion Density
40%
WC-Co
39%
Plasma Parameters
38%
Carbon Coating
33%
CVD Diamond Film
30%
Etching Behavior
30%
Modeling Software
28%
DC Bias Voltage
28%
Microgroove
28%
Oxygen Plasma
27%
Pressure Effect
26%
Langmuir Probe
25%
DC Bias
24%
Argon Plasma
24%
Plasma Polishing
24%
Experiment Set
24%
Biosynthesized Silver Nanoparticles
24%
CVD Diamond
24%
Jatropha Leaves
24%
Pulsed Plasma Nitriding
24%
Vertical Graphene
24%
RF-DC Plasma
24%
Gas Mixture
24%
Plasma Etching
24%
Plasma System
24%
Leaf Extract
24%
Jatropha Curcas
24%
Stamping
24%
Graphite
24%
Temperature Effect
24%
Ag Nanoparticles (AgNPs)
24%
Experimental Dynamics
24%
Molecular Dynamics Study
24%
Al2O3 Ceramic
24%
Magnesium Alloy
24%
Low Sintering
24%
Sintering Conditions
24%
Diamond Film
22%
Etching Process
19%
Plasma Density
18%
Plasma Generation
16%
Material Science
Plasma Etching
100%
Diamond
76%
Chemical Vapor Deposition
57%
Carrier Concentration
57%
Density
52%
Cathode
51%
Diamond-Like Carbon
48%
Surface (Surface Science)
44%
Diamond Films
43%
Diamond-Like Carbon Coating
24%
Stamping
24%
Graphene
24%
Sintering Temperature
24%
Al2O3
24%
Aluminum Oxide
24%
Magnesium Alloy
24%
Sol-Gel
24%
Plasma Density
14%
Inert Gas
12%
Reactive Ion Etching
12%
Process Simulation
9%
Polishing
9%
Raman Spectroscopy
9%
Carbon Dioxide
8%
Desorption
8%
Carbon Monoxide
8%
Austenitic Stainless Steel
8%
X-Ray Diffraction
6%
Sintering
6%
Emission Spectroscopy
6%
Linewidth
6%
Stainless Steel
6%
Surface Modification
6%
Engineering
Carrier Concentration
54%
Plasma Diagnostics
33%
Bias Voltage
28%
Ion Density
28%
Chemical Vapor Deposition
24%
Gas Mixture
24%
Diamond
24%
Plasma Nitriding
24%
Plasma System
21%
Electric Field
19%
Plasma Density
13%
Diamond Coating
12%
Gas Pressure
10%
Simulation Process
9%
Field Distribution
9%
Hydrogen Gas
8%
Nitriding Process
8%
Hydrogen Molecule
8%
Gas Content
8%
Great Influence
8%
Austenitic Stainless Steel
8%
Low Temperature Nitriding
8%
Polishing Process
6%
Coating Material
6%
Electron Bombardment
6%